DDR2 SDRAM memory chip with 1Gbit density, organized as 128Mx8 for an 8-bit data bus. Features a 60-pin FBGA package with a 0.8mm pin pitch, designed for surface mounting. Operates at a maximum clock rate of 800 MHz with a typical supply voltage of 1.8V. Offers 8 internal banks and a maximum access time of 0.4 ns, suitable for a wide operating temperature range of -40°C to 95°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
SK Hynix H5PS1G83EFR-S6I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
11.4
Package Width (mm)
8
Package Height (mm)
0.76
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
1Gbit
Type
DDR2 SDRAM
Organization
128Mx8
Data Bus Width
8bit
Maximum Clock Rate
800MHz
Number of Internal Banks
8
Number of Words per Bank
16M
Maximum Access Time
0.4ns
Density in Bits
1073741824bit
Address Bus Width
17bit
Maximum Operating Current
170mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
95°C
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8542320032
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix H5PS1G83EFR-S6I Datasheet
Download the complete datasheet for SK Hynix H5PS1G83EFR-S6I to view detailed technical specifications.
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