DDR3 SDRAM chip, 2 Gbit density, organized as 512Mx4 with a 4-bit data bus width. Features a maximum clock rate of 1333 MHz and operates at a typical 1.5V supply voltage. Housed in an 82-pin FBGA package with a 0.8mm pin pitch, this surface-mount component offers 8 internal banks and 18 address bits. Operating temperature range is 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
SK Hynix H5TQ2G43BFR-H9C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
82
PCB
82
Package Length (mm)
11.1
Package Width (mm)
9.4
Package Height (mm)
0.76
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Type
DDR3 SDRAM
Organization
512Mx4
Data Bus Width
4bit
Maximum Clock Rate
1333MHz
Number of Internal Banks
8
Number of Words per Bank
64M
Density in Bits
2147483648bit
Address Bus Width
18bit
Typical Operating Supply Voltage
1.5V
Max Operating Supply Voltage
1.575V
Min Operating Supply Voltage
1.425V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix H5TQ2G43BFR-H9C Datasheet
Download the complete datasheet for SK Hynix H5TQ2G43BFR-H9C to view detailed technical specifications.
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