2Gbit DDR3 SDRAM memory chip, organized as 512Mx4, featuring a 4-bit data bus width and an 18-bit address bus. Operates at a maximum clock rate of 1866 MHz with a typical supply voltage of 1.5V. Housed in an 82-pin FBGA package with a 0.8mm pin pitch, measuring 11.1mm x 9.4mm x 0.76mm. Supports 8 internal banks, each with 64M words, and operates within a temperature range of 0°C to 85°C. Surface mountable with a plastic package material.
PackageFBGA
MountingSurface Mount
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Technical Specifications
SK Hynix H5TQ2G43BFR-RDC technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
82
PCB
82
Package Length (mm)
11.1
Package Width (mm)
9.4
Package Height (mm)
0.76
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Type
DDR3 SDRAM
Organization
512Mx4
Data Bus Width
4bit
Maximum Clock Rate
1866MHz
Number of Internal Banks
8
Number of Words per Bank
64M
Density in Bits
2147483648bit
Address Bus Width
18bit
Typical Operating Supply Voltage
1.5V
Max Operating Supply Voltage
1.575V
Min Operating Supply Voltage
1.425V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
SK Hynix H5TQ2G43BFR-RDC Datasheet
Download the complete datasheet for SK Hynix H5TQ2G43BFR-RDC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.