2Gbit DDR3 SDRAM memory chip, organized as 128Mx16, features a 16-bit data bus and operates at a maximum clock rate of 1066 MHz. This surface-mount component utilizes a 96-pin Fine Pitch Ball Grid Array (FBGA) package with a 0.8mm pin pitch and dimensions of 13mm x 9mm x 0.76mm. It offers 8 internal banks, each with 16M words, and a maximum access time of 20 ns. The chip operates from a typical supply voltage of 1.5V, with a maximum operating current of 105 mA, and is rated for an operating temperature range of 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
SK Hynix H5TQ2G63BFR-G7C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
96
PCB
96
Package Length (mm)
13
Package Width (mm)
9
Package Height (mm)
0.76
Seated Plane Height (mm)
1.1
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
2Gbit
Type
DDR3 SDRAM
Organization
128Mx16
Data Bus Width
16bit
Maximum Clock Rate
1066MHz
Number of Internal Banks
8
Number of Words per Bank
16M
Maximum Access Time
20ns
Density in Bits
2147483648bit
Address Bus Width
17bit
Maximum Operating Current
105mA
Typical Operating Supply Voltage
1.5V
Max Operating Supply Voltage
1.575V
Min Operating Supply Voltage
1.425V
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
9162F
EU RoHS
Yes
HTS Code
8542320036
Schedule B
8542320023
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
SK Hynix H5TQ2G63BFR-G7C Datasheet
Download the complete datasheet for SK Hynix H5TQ2G63BFR-G7C to view detailed technical specifications.
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