The STI7162ZUC is a Ball Grid Array packaged IC with 700 pins, designed for surface mount applications. It has a package length and width of 27mm, and a seated plane height of 2.19mm. The package material is plastic, and it is classified as a Fine Pitch Ball Grid Array. This IC is suitable for use in a variety of applications, including those requiring a high level of integration and complexity.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Stmicroelectronics STI7162ZUC technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 700 |
| PCB | 700 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Seated Plane Height (mm) | 2.19 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | SCR76 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Stmicroelectronics STI7162ZUC Datasheet
Download the complete datasheet for Stmicroelectronics STI7162ZUC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.