PackageDO-35
MountingThrough Hole
Power500mW
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Technical Specifications
Taiwan Semiconductor BZX55C15R0 technical specifications.
General
| Package/Case | DO-35 |
| Diameter | 2.1mm |
| Impedance | 30R |
| Lead Free | Lead Free |
| Length | 3.7mm |
| Max Operating Temperature | 200°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 500mW |
| Max Reverse Leakage Current | 100nA |
| Mount | Through Hole |
| Packaging | Tape and Reel |
| Power Dissipation | 500mW |
| Radiation Hardening | No |
| Voltage Tolerance | 6% |
| Zener Voltage | 14.7V |
Compliance
| RoHS | Compliant |
Datasheet
Taiwan Semiconductor BZX55C15R0 Datasheet
Download the complete datasheet for Taiwan Semiconductor BZX55C15R0 to view detailed technical specifications.
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