PackageTDFN EP
MountingSurface Mount
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Technical Specifications
Taiwan Semiconductor TSM301K12CQ RFG technical specifications.
General
| Package/Case | TDFN EP |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 2.05(Max) |
| Package Width (mm) | 2.05(Max) |
| Package Height (mm) | 0.8(Max) |
| Mounting | Surface Mount |
| Configuration | Single |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | P |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage | 20V |
| Maximum Gate Source Voltage | ±12V |
| Maximum Continuous Drain Current | 4.5A |
| Maximum Drain Source Resistance | [email protected]mOhm |
| Typical Gate Charge @ Vgs | 5.2@5VnC |
| Typical Input Capacitance @ Vds | 5.2@6VpF |
| Maximum Power Dissipation | 1560mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | SDM41 |
| EU RoHS | Yes |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Taiwan Semiconductor TSM301K12CQ RFG Datasheet
Download the complete datasheet for Taiwan Semiconductor TSM301K12CQ RFG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.