PackageRadial
MountingThrough Hole
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Technical Specifications
TDK B57211P200M301 technical specifications.
General
| Package/Case | Radial |
| Contact Plating | Tin |
| Depth | 6mm |
| Height | 20mm |
| Lead Free | Lead Free |
| Mount | Through Hole |
| Packaging | Bulk |
| Tolerance | 20% |
Compliance
| RoHS | Compliant |
Datasheet
TDK B57211P200M301 Datasheet
Download the complete datasheet for TDK B57211P200M301 to view detailed technical specifications.
No datasheet is available for this part.