PackageBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments AFE5803ZCF technical specifications.
General
| Package/Case | BGA |
| Contact Plating | Copper, Tin, Silver |
| Interface | LVDS, Serial |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Max Power Dissipation | 190mW |
| Mount | Surface Mount |
| Number of A/D Converters | 8 |
| Number of Bits | 14 |
| Number of Channels | 8 |
| Number of Converters | 8 |
| Number of Inputs | 8 |
| Operating Supply Current | 210mA |
| Package Quantity | 160 |
| Packaging | Tray |
| Radiation Hardening | No |
| Resolution | 14b |
| RoHS Compliant | Yes |
| Sampling Rate | 65000KS/s |
| Type | General Purpose |
Compliance
| RoHS | Compliant |
Datasheet
Texas Instruments AFE5803ZCF Datasheet
Download the complete datasheet for Texas Instruments AFE5803ZCF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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