Frequency300MHz
PackageLFBGA
Voltage1.32V
MountingSurface Mount
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Technical Specifications
Texas Instruments AM1802BZCED3 technical specifications.
General
Package/Case
LFBGA
Contact Plating
Copper, Tin, Silver
Core Architecture
ARM
Data Bus Width
32b
Frequency
300MHz
Lead Free
Contains Lead
Max Frequency
300MHz
Max Operating Temperature
90°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.2V
Memory Size
16KB
Min Supply Voltage
950mV
Mount
Surface Mount
Number of Cores
1
Number of Timers/Counters
4
Number of UART Channels
3
Package Quantity
160
Packaging
Tray
Radiation Hardening
No
RAM Size
8KB
RoHS Compliant
Yes
Series
Sitara™
Voltage
1.32V
Compliance
RoHS
Compliant
Datasheet
Texas Instruments AM1802BZCED3 Datasheet
Download the complete datasheet for Texas Instruments AM1802BZCED3 to view detailed technical specifications.
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