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Technical Specifications
Texas Instruments AM3354BZCE30 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Interface
I2C, SPI, USB, CAN, Ethernet, UART
Lead Free
Contains Lead
Max Frequency
300MHz
Max Operating Temperature
90°C
Memory Type
ROM, RAM
Min Operating Temperature
0°C
Number of Cores
1
Operating Supply Voltage
1.1V
Package Quantity
160
Packaging
Rail/Tube
Radiation Hardening
No
RAM Size
64KB
Series
Sitara™
Compliance
RoHS
Compliant
Datasheet
Texas Instruments AM3354BZCE30 Datasheet
Download the complete datasheet for Texas Instruments AM3354BZCE30 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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