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Technical Specifications
Texas Instruments AM3354BZCEA30 technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Interface | I2C, SPI, USB, CAN, Ethernet, UART |
| Lead Free | Contains Lead |
| Max Frequency | 300MHz |
| Max Operating Temperature | 105°C |
| Memory Type | ROM, RAM |
| Min Operating Temperature | -40°C |
| Number of Cores | 1 |
| Operating Supply Voltage | 1.1V |
| Package Quantity | 160 |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RAM Size | 64KB |
| Series | Sitara™ |
Compliance
| RoHS | Compliant |
Datasheet
Texas Instruments AM3354BZCEA30 Datasheet
Download the complete datasheet for Texas Instruments AM3354BZCEA30 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.