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Technical Specifications
Texas Instruments AM3354BZCZD30 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
32b
Interface
I2C, SPI, USB, CAN, Ethernet, UART
Lead Free
Contains Lead
Max Frequency
300MHz
Max Operating Temperature
90°C
Memory Type
ROM, RAM
Min Operating Temperature
-40°C
Number of Cores
1
Operating Supply Voltage
1.1V
Package Quantity
126
Packaging
Rail/Tube
Radiation Hardening
No
RAM Size
64KB
Series
Sitara™
Weight
0.060453oz
Compliance
RoHS
Compliant
Datasheet
Texas Instruments AM3354BZCZD30 Datasheet
Download the complete datasheet for Texas Instruments AM3354BZCZD30 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.