The 64-Pin HTQFP EP Lead-Frame SMT IC is a surface mount package with a heat sinked thin quad flat package and exposed pad. It has a maximum package length of 10.2mm, width of 10.2mm, and height of 1.05mm. The seated plane height is 1.2mm, and the pin pitch is 0.5mm. The IC operates between -40°C and 105°C. It is a lead-frame SMT package with a plastic material and gull-wing leads.
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Texas Instruments AMC7812SPAP technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | HTQFP EP |
| Package Description | Heat Sinked Thin Quad Flat Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 64 |
| PCB | 64 |
| Package Length (mm) | 10.2(Max) |
| Package Width (mm) | 10.2(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026ACD |
| Category | Analog Monitoring and Control Circuitry |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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