PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments BQ24278YFFT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
49
PCB
49
Package Length (mm)
3.1
Package Width (mm)
3.1
Package Height (mm)
0.43
Seated Plane Height (mm)
0.63(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Type
Switching Battery Charger
Battery Type
Li-Ion|Li-Pol
Min Operating Supply Voltage
4.2V
Max Operating Supply Voltage
18V
Output Voltage
4.2V
Output Current
2500(Max)mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments BQ24278YFFT Datasheet
Download the complete datasheet for Texas Instruments BQ24278YFFT to view detailed technical specifications.
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