CMOS NAND Gate IC featuring 4 independent 2-input NAND elements. This 14-pin Ceramic Dual In-line Package (CDIP) with through-hole mounting offers a push-pull output type. Operating across a wide temperature range from -55°C to 125°C, it utilizes the CD4000 logic family. The package dimensions are 19.94mm (L) x 7.62mm (W) x 3.56mm (H) with a 2.54mm pin pitch.
PackageCDIP
MountingThrough Hole
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Technical Specifications
Texas Instruments CD4011BF technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
14
PCB
14
Package Length (mm)
19.94(Max)
Package Width (mm)
7.62(Max)
Package Height (mm)
3.56(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Jedec
MS-030AB
Logic Family
CD4000
Logic Function
NAND
Process Technology
CMOS
Number of Elements per Chip
4
Number of Element Inputs
2-IN
Number of Element Outputs
1
Output Type
Push-Pull
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
01295
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments CD4011BF Datasheet
Download the complete datasheet for Texas Instruments CD4011BF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.