CMOS NAND Gate IC featuring 4 independent 2-input NAND elements. This 14-pin Ceramic Dual In-line Package (CDIP) with through-hole mounting offers a push-pull output type. Operating across a wide temperature range from -55°C to 125°C, it utilizes the CD4000 logic family. The package dimensions are 19.94mm (L) x 7.62mm (W) x 3.56mm (H) with a 2.54mm pin pitch.
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Texas Instruments CD4011BF technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | CDIP |
| Package Description | Ceramic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 19.94(Max) |
| Package Width (mm) | 7.62(Max) |
| Package Height (mm) | 3.56(Max) |
| Seated Plane Height (mm) | 5.08(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Jedec | MS-030AB |
| Logic Family | CD4000 |
| Logic Function | NAND |
| Process Technology | CMOS |
| Number of Elements per Chip | 4 |
| Number of Element Inputs | 2-IN |
| Number of Element Outputs | 1 |
| Output Type | Push-Pull |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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