The CD74AC273M96E4 is a 20-pin SOIC lead-frame SMT flip-flop from Texas Instruments, packaged in a small outline IC with a gull-wing lead shape. It is designed for surface mount applications with a maximum seated plane height of 2.65mm and a pin pitch of 1.27mm. The device is made of plastic and has a maximum package length and width of 13mm and 7.6mm, respectively. It operates within a temperature range that is not specified in the provided data.
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Texas Instruments CD74AC273M96E4 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 13(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.35(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AC |
| Cage Code | 01295 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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