PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments CD74AC573M96E4 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
13(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.35(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AC
Compliance
Cage Code
01295
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments CD74AC573M96E4 Datasheet
Download the complete datasheet for Texas Instruments CD74AC573M96E4 to view detailed technical specifications.
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