The CD74ACT175M96G4 is a 16-pin SOIC lead-frame SMT flip-flop from Texas Instruments. It features a small outline IC package with gull-wing leads and a surface mount configuration. The device is rated for use in surface mount applications and is packaged in a plastic case with a maximum package length of 10mm, width of 4mm, and height of 1.5mm. The seated plane height is 1.75mm and the pin pitch is 1.27mm. The device is compliant with the MS-012AC Jedec standard.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Texas Instruments CD74ACT175M96G4 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments CD74ACT175M96G4 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
