The CD74ACT175M96G4 is a 16-pin SOIC lead-frame SMT flip-flop from Texas Instruments. It features a small outline IC package with gull-wing leads and a surface mount configuration. The device is rated for use in surface mount applications and is packaged in a plastic case with a maximum package length of 10mm, width of 4mm, and height of 1.5mm. The seated plane height is 1.75mm and the pin pitch is 1.27mm. The device is compliant with the MS-012AC Jedec standard.
PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments CD74ACT175M96G4 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments CD74ACT175M96G4 Datasheet
Download the complete datasheet for Texas Instruments CD74ACT175M96G4 to view detailed technical specifications.
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