The CD74HC74ME4 is a 14-pin SOIC flip-flop from Texas Instruments, packaged in a lead-frame SMT package. It is designed for surface mount applications and has a maximum package length of 8.75mm, width of 4mm, and height of 1.5mm. The device has a seated plane height of 1.75mm and a pin pitch of 1.27mm. It is constructed from plastic and meets the Jedec MS-012AB standard.
PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments CD74HC74ME4 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.75(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments CD74HC74ME4 Datasheet
Download the complete datasheet for Texas Instruments CD74HC74ME4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.