Clock buffer IC featuring 2 outputs and 1 input with a 1:1 ratio. This surface-mount device utilizes a Die Size Ball Grid Array (DSBGA) package, measuring 1.6mm x 0.8mm with an 8-pin configuration and 0.4mm pin pitch. Operating within a 2.3V to 5.5V supply range, it supports a maximum input frequency of 52 MHz and functions across a temperature range of -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.6 |
| Package Width (mm) | 0.8 |
| Package Height (mm) | 0.33(Max) |
| Seated Plane Height (mm) | 0.5(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | Buffer |
| Number of Outputs per Chip | 2 |
| Maximum Input Frequency | 52MHz |
| Min Operating Supply Voltage | 2.3V |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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