PackageDIP
MountingThrough Hole
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Technical Specifications
Texas Instruments COP8SAC740N9 technical specifications.
General
Access Time
10us
Package/Case
DIP
Interface
SPI
Lead Free
Contains Lead
Max Operating Temperature
70°C
Memory Size
4KB
Memory Type
OTP,
Min Operating Temperature
0°C
Mount
Through Hole
Number of I/Os
36
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT
RAM Size
128B
RoHS Compliant
No
Series
COP8™ 8SA
Compliance
RoHS
Not Compliant
Datasheet
Texas Instruments COP8SAC740N9 Datasheet
Download the complete datasheet for Texas Instruments COP8SAC740N9 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.