D-Type Bus Interface Flip-Flop, featuring positive-edge triggering and 3-state outputs. This integrated circuit contains two independent elements, each with 9 inputs and 9 outputs. Designed with CMOS process technology and an FCT logic family, it offers non-inverting polarity. Packaged in a 56-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting, it operates within a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Texas Instruments CY74FCT162823BTPAC technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
56
PCB
56
Package Length (mm)
14.1(Max)
Package Width (mm)
6.2(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153
Logic Family
FCT
Logic Function
D-Type Bus Interface
Process Technology
CMOS
Number of Elements per Chip
2
Number of Element Inputs
9
Number of Element Outputs
9
Output Type
3-State
Polarity
Non-Inverting
Triggering Type
Positive-Edge
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments CY74FCT162823BTPAC Datasheet
Download the complete datasheet for Texas Instruments CY74FCT162823BTPAC to view detailed technical specifications.
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