Dual D-type bus interface flip-flop with positive-edge triggering and 3-state outputs. Features 9 inputs and 9 non-inverting outputs per element, utilizing CMOS process technology within the FCT logic family. Housed in a 56-pin TSSOP (Thin Shrink Small Outline Package) with gull-wing leads for surface mounting, offering a maximum package length of 14.1mm and a 0.5mm pin pitch. Operates across a temperature range of -40°C to 85°C.
PackageTSSOP
MountingSurface Mount
PolarityNon-Inverting
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Technical Specifications
Texas Instruments CY74FCT16823BTPAC technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 14.1(Max) |
| Package Width (mm) | 6.2(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153 |
| Logic Family | FCT |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 9 |
| Number of Element Outputs | 9 |
| Output Type | 3-State |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments CY74FCT16823BTPAC Datasheet
Download the complete datasheet for Texas Instruments CY74FCT16823BTPAC to view detailed technical specifications.
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