PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments CYBUS3384SOC technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 15.6(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.35(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AD |
| Logic Function | Bus Switch |
| Configuration | 5 x 1:1 |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 10 |
| Number of Outputs per Chip | 10 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments CYBUS3384SOC Datasheet
Download the complete datasheet for Texas Instruments CYBUS3384SOC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.