Texas Instruments
DM355SZCE135
IC SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337, Microprocessor IC:Other
Frequency135MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments DM355SZCE135 technical specifications.
General
| Package/Case | LFBGA |
| Core Architecture | ARM |
| Data Bus Width | 16b |
| Frequency | 135MHz |
| Height | 0.9mm |
| Interface | SPI, USB, UART, I2C |
| Lead Free | Lead Free |
| Length | 13mm |
| Max Frequency | 135MHz |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Mount | Surface Mount |
| Number of Cores | 1 |
| Number of I/Os | 104 |
| Number of UART Channels | 3 |
| Operating Supply Voltage | 1.3V |
| Package Quantity | 160 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 32KB |
| RoHS Compliant | Yes |
| Series | TMS320DM3x, DaVinci™ |
| Width | 13mm |
Compliance
| RoHS | Compliant |
Datasheet
Texas Instruments DM355SZCE135 Datasheet
Download the complete datasheet for Texas Instruments DM355SZCE135 to view detailed technical specifications.
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