Texas Instruments
DM355SZCE216
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
Frequency216MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments DM355SZCE216 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
16b
Frequency
216MHz
Height
0.9mm
Interface
SPI, USB, UART, I2C
Lead Free
Lead Free
Length
13mm
Max Frequency
216MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Mount
Surface Mount
Number of Cores
1
Number of I/Os
104
Number of UART Channels
3
Operating Supply Voltage
1.3V
Package Quantity
160
Packaging
Tray
RAM Size
32KB
RoHS Compliant
Yes
Series
TMS320DM3x, DaVinci™
Width
13mm
Compliance
RoHS
Compliant
Datasheet
Texas Instruments DM355SZCE216 Datasheet
Download the complete datasheet for Texas Instruments DM355SZCE216 to view detailed technical specifications.
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