Texas Instruments
DM355SZCE270
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
Frequency270MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments DM355SZCE270 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
16b
Frequency
270MHz
Interface
SPI, USB, UART, I2C
Lead Free
Lead Free
Max Frequency
270MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Max Supply Voltage
1.365V
Min Supply Voltage
1.235V
Mount
Surface Mount
Number of Cores
1
Number of I/Os
104
Number of UART Channels
3
Operating Supply Voltage
1.3V
Package Quantity
160
Packaging
Tray
Radiation Hardening
No
RAM Size
32KB
RoHS Compliant
Yes
Series
TMS320DM3x, DaVinci™
Compliance
RoHS
Compliant
Datasheet
Texas Instruments DM355SZCE270 Datasheet
Download the complete datasheet for Texas Instruments DM355SZCE270 to view detailed technical specifications.
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