The DS22EV5110SQX/NOPB is a specialized IC in a 48-pin WQFN EP package with a very thin quad flat no lead design and exposed pad. It is a surface mount device with a maximum package length of 7.15mm, width of 7.15mm, and height of 0.8mm to 0.05mm. The IC is made of plastic and has a pin pitch of 0.5mm. It conforms to the MO-220 Jedec standard.
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Texas Instruments DS22EV5110SQX/NOPB technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | WQFN EP |
| Package Description | Very Very Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 7.15(Max) |
| Package Width (mm) | 7.15(Max) |
| Package Height (mm) | 0.8(Max) - 0.05 |
| Seated Plane Height (mm) | 0.8(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220 |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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