The DS90UR916QSQE is a 60-pin surface mount LVDS interface IC from Texas Instruments, packaged in a WQFN EP package with a maximum package length of 9.1mm, width of 9.1mm, and height of 0.75mm. It features a non-lead frame SMT package type and a very thin quad flat no lead package with an exposed pad. The IC is designed for surface mount applications and has a maximum seated plane height of 0.8mm and a pin pitch of 0.5mm. The package material is plastic and the JEDEC designation is MO-263VGGD.
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Texas Instruments DS90UR916QSQE technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | WQFN EP |
| Package Description | Very Very Thin Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 60 |
| PCB | 60 |
| Package Length (mm) | 9.1(Max) |
| Package Width (mm) | 9.1(Max) |
| Package Height (mm) | 0.75(Max) |
| Seated Plane Height (mm) | 0.8(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-263VGGD |
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
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