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Technical Specifications
Texas Instruments LME49880MR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HSOP EP
Package Description
Heat Sinked Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
4(Max)
Package Height (mm)
1.55(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
01295
EU RoHS
No
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments LME49880MR Datasheet
Download the complete datasheet for Texas Instruments LME49880MR to view detailed technical specifications.
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