PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments LMP8602MAX/NOPB technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
5(Max)
Package Width (mm)
3.98(Max)
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AA
Type
Current Sense Amplifier
Number of Elements per Chip
2
Number of Channels per Chip
1
Minimum PSRR
70dB
Maximum Input Offset Voltage
1@5VmV
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments LMP8602MAX/NOPB Datasheet
Download the complete datasheet for Texas Instruments LMP8602MAX/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.