PackageSOIC
MountingSurface Mount
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Technical Specifications
Texas Instruments LMP8602QMAX/NOPB technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 5(Max) |
| Package Width (mm) | 3.98(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AA |
| Type | Current Sense Amplifier |
| Number of Elements per Chip | 2 |
| Number of Channels per Chip | 1 |
| Minimum PSRR | 70dB |
| Maximum Input Offset Voltage | 1@5VmV |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LMP8602QMAX/NOPB Datasheet
Download the complete datasheet for Texas Instruments LMP8602QMAX/NOPB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.