PackageDSBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Texas Instruments LMV1091TM technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 25 |
| PCB | 25 |
| Package Length (mm) | 2.04(Max) |
| Package Width (mm) | 2.04(Max) |
| Package Height (mm) | 0.47(Max) |
| Seated Plane Height (mm) | 0.6 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Microphone/Speaker |
| Amplifier Type | Class-AB |
| Typical PSRR | 99dB |
| Input Signal Type | Differential |
| Output Signal Type | Differential |
| Output Type | 1-Channel Mono |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | No |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments LMV1091TM Datasheet
Download the complete datasheet for Texas Instruments LMV1091TM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.