16-bit RISC microcontroller featuring 16KB Flash program memory and 2KB RAM. This surface-mount device utilizes a Die Size Ball Grid Array (DSBGA) package with 49 pins, measuring 3.1mm x 3.1mm x 0.43mm, and a 0.4mm pin pitch. It operates at up to 16 MHz with support for I2C, SCI, SPI, and UART interfaces, and includes two timers and 32 programmable I/Os. The operating voltage range is 2.5V to 3.6V, with an operating temperature range of -40°C to 85°C.
PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments MSP430F2350IYFFR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
49
PCB
49
Package Length (mm)
3.1
Package Width (mm)
3.1
Package Height (mm)
0.43
Seated Plane Height (mm)
0.63(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Family Name
MSP430
Data Bus Width
16bit
Instruction Set Architecture
RISC
Maximum Clock Rate
16MHz
Maximum CPU Frequency
16MHz
Device Core
MSP430
Program Memory Type
Flash
Program Memory Size
16KB
RAM Size
2KB
Number of Programmable I/Os
32
Core Architecture
MSP430
Programmability
Yes
Number of Timers
2
Interface Type
I2C/SCI/SPI/UART
CAN
0
I2C
1
SPI
2
Ethernet
0
UART
1
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Number of DACs
Single
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments MSP430F2350IYFFR Datasheet
Download the complete datasheet for Texas Instruments MSP430F2350IYFFR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.