PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments OMAP3503DCBBA technical specifications.
General
Package/Case
FCBGA
Core Architecture
ARM
Data Bus Width
32b
Lead Free
Contains Lead
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.89V
Memory Type
ROM, L2 Cache
Min Supply Voltage
1.71V
Mount
Surface Mount
Number of Cores
1
Number of UART Channels
3
Package Quantity
1
Packaging
Tray
Radiation Hardening
No
RAM Size
65536B
RoHS Compliant
Yes
Series
OMAP-35xx
Compliance
RoHS
Compliant
Datasheet
Texas Instruments OMAP3503DCBBA Datasheet
Download the complete datasheet for Texas Instruments OMAP3503DCBBA to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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