PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments OMAP3503DZCBCS technical specifications.
General
Package/Case
FCBGA
Core Architecture
ARM
Data Bus Width
32b
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Type
ROM, L2 Cache
Min Operating Temperature
-45°C
Mount
Surface Mount
Number of Cores
1
Number of UART Channels
3
Operating Supply Voltage
1.35V
Package Quantity
168
Packaging
Tray
Radiation Hardening
No
RAM Size
65536B
RoHS Compliant
Yes
Series
OMAP-35xx
Compliance
RoHS
Compliant
Datasheet
Texas Instruments OMAP3503DZCBCS Datasheet
Download the complete datasheet for Texas Instruments OMAP3503DZCBCS to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.