Applications Processor, System on Chip (SoC) featuring an ARM Cortex A8 core, operating at a maximum clock rate of 720 MHz. This 32-bit microprocessor utilizes 65nm process technology and offers 64KB of RAM and 112KB of ROM. Packaged in a 423-pin Ball Grid Array (BGA) with a 0.65mm pin pitch, it supports surface mount installation. Key interfaces include I2C (3), UART (3), and USB (4), with dual 10-bit DACs.
PackageBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments OMAP3530ECUS72 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Ball Grid Array
Lead Shape
Ball
Pin Count
423
PCB
423
Package Length (mm)
16
Package Width (mm)
16
Package Height (mm)
0.96
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Family Name
OMAP3
Device Core
ARM Cortex A8
Maximum Clock Rate
720MHz
Program Memory Type
ROM
Data Bus Width
32bit
Maximum Speed
720MHz
Program Memory Size
112KB
Process Technology
65nm
RAM Size
64KB
DAC Resolution
10/10bit
Number of DACs
Dual
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.89V
Typical Operating Supply Voltage
1.8V
Number of Programmable I/Os
188
Application
Portable Navigation Devices/Portable Media Player/Advanced Portable Consumer Electronics/Digital TV/Digital Video Camera/Portable Data Collection/Point-of-Sale Devices/Gaming/Web Tablet/Smart White Goods/Smart Home Controllers/Ultra Mobile Devices
Min Operating Temperature
0°C
Max Operating Temperature
90°C
Interface Type
I2C/SPI/UART/USB
SPI
1
I2C
3
I2S
0
UART
3
USB
4
USART
0
CAN
0
Ethernet
0
Number of Timers
13
Programmability
Yes
Core Architecture
ARM
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments OMAP3530ECUS72 Datasheet
Download the complete datasheet for Texas Instruments OMAP3530ECUS72 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.