The OMAPL137AZKB3 is a single-core microprocessor from Texas Instruments, featuring an ARM core architecture. It is packaged in a BGA and designed for surface mount applications. The device operates within a temperature range of 0 to 90°C. It is available in a tray packaging format. This microprocessor does not offer radiation hardening and is not RoHS compliant.
PackageBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments OMAPL137AZKB3 technical specifications.
General
| Package/Case | BGA |
| Core Architecture | ARM |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | 0°C |
| Mount | Surface Mount |
| Number of Cores | 1 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Series | OMAP-L1x |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Texas Instruments OMAPL137AZKB3 Datasheet
Download the complete datasheet for Texas Instruments OMAPL137AZKB3 to view detailed technical specifications.
No datasheet is available for this part.
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