This industrial-grade microcontroller is packaged in a 32-ball LFBGA package with a 10x10mm footprint. It is rated for operation between -40°C and 85°C. The device is not radiation hardened and is not RoHS compliant. It is available in a tray packaging format with 240 units per package.
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Texas Instruments SCANSTA112SM technical specifications.
| Package/Case | FBGA |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Moisture Sensitivity Level | 3 |
| Mount | Surface Mount |
| Number of Functions | 1 |
| Package Body Material | Plastic |
| Package Code | LFBGA |
| Package Quantity | 240 |
| Package Shape | Square |
| Packaging | Tray |
| Peak Reflow Temperature (Cel) | 235°C |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Surface Mount | Yes |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin |
| Terminal Form | Ball |
| Terminal Position | BOTTOM |
| Time @ Peak Reflow Temperature-Max (s) | 30s |
| Width | 10mm |
| RoHS | Not CompliantNo |
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