Dual D-Type positive-edge triggered flip-flop, CMOS logic family, featuring two independent elements. Surface mountable in an 8-pin DSBGA package with a 0.4mm pin pitch, measuring 1.6mm x 0.8mm x 0.33mm. Operates across a temperature range of -40°C to 85°C.
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Texas Instruments SN74AUP2G80YFPR technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 1.6 |
| Package Width (mm) | 0.8 |
| Package Height (mm) | 0.33(Max) |
| Seated Plane Height (mm) | 0.5(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | AUP |
| Logic Function | D-Type |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 1 |
| Number of Element Outputs | 1 |
| Polarity | Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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