PackageHTQFP EP
MountingSurface Mount
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Technical Specifications
Texas Instruments TAS5709AGPHPR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
HTQFP EP
Package Description
Heat Sinked Thin Quad Flat Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
7.2(Max)
Package Width (mm)
7.2(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-D
Input Signal Type
Single
Output Signal Type
Differential
Output Type
2-Channel Stereo
Maximum Output Current
20mA
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TAS5709AGPHPR Datasheet
Download the complete datasheet for Texas Instruments TAS5709AGPHPR to view detailed technical specifications.
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