PackageHTQFP EP
MountingSurface Mount
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Technical Specifications
Texas Instruments THS8200IPFPEP technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
HTQFP EP
Package Description
Heat Sinked Thin Quad Flat Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
80
PCB
80
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Converter Type
Video
Resolution
11bit
Maximum Settling Time
0.0066(Typ)us
Conversion Rate
205Msps
Digital Interface Type
Serial (I2C)
Output Type
Voltage
Number of DAC Channels
3
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments THS8200IPFPEP Datasheet
Download the complete datasheet for Texas Instruments THS8200IPFPEP to view detailed technical specifications.
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