Quad-channel, low-power operational amplifier featuring rail-to-rail input and output. This surface-mount integrated circuit offers a 6.4 MHz gain bandwidth product and operates from single supplies of 2.7V to 6V or dual supplies of ±1.35V to ±3V. Packaged in a 14-pin SOIC (Small Outline IC) with gull-wing leads, it supports a wide operating temperature range of -55°C to 125°C.
PackageSOIC
MountingSurface Mount
Quick Jump:
Technical Specifications
Texas Instruments TLV2464AMDREPG4 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.75(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
| Manufacturer Type | Low Power Amplifier |
| Type | Low Power Amplifier |
| Number of Channels per Chip | 4 |
| Rail to Rail | Rail to Rail Input/Output |
| Typical Gain Bandwidth Product | 6.4MHz |
| Maximum Input Offset Voltage | 1.5@5VmV |
| Maximum Input Offset Current | 0.007@5VuA |
| Maximum Input Bias Current | 0.014@5VuA |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Typical Single Supply Voltage | 3|5V |
| Maximum Single Supply Voltage | 6V |
| Minimum Dual Supply Voltage | ±1.35V |
| Maximum Dual Supply Voltage | ±3V |
| Maximum Supply Voltage Range | 6 to 9V |
| Max Operating Supply Voltage | ±3|6V |
| Minimum Single Supply Voltage | 2.7V |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments TLV2464AMDREPG4 Datasheet
Download the complete datasheet for Texas Instruments TLV2464AMDREPG4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.