16-bit fixed-point digital signal processor (DSP) operating at 120 MHz, delivering 240 MIPS. Features 128KB ROM and 256KB RAM, with a C55x core architecture. Surface-mount NFBGA package with 196 pins, measuring 10x10x0.86mm, and a 0.65mm pin pitch. Supports I2C, I2S, SPI, UART, and USB interfaces. Operates across a temperature range of -40°C to 85°C with a typical supply voltage range of 1.3V to 3.3V.
PackageNFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C5514AZCHA12 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
NFBGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
10
Package Width (mm)
10
Package Height (mm)
0.86
Seated Plane Height (mm)
1.3(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Family Name
TMS320
Data Bus Width
16bit
Numeric and Arithmetic Format
Fixed-Point
Device Core
C55x
Program Memory Type
ROM
Program Memory Size
128KB
RAM Size
256KB
Core Architecture
C55x
Maximum Speed
120MHz
Number of Programmable I/Os
26
Device Million Instructions per Second
240MIPS
Device Input Clock Speed
120MHz
Typical Operating Supply Voltage
1.3|1.8|2.5|2.8|3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
I2C/I2S/SPI/UART/USB
I2C
1
CAN
0
UART
1
Ethernet
0
USART
0
USB
1
SPI
1
I2S
4
Programmability
Yes
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320C5514AZCHA12 Datasheet
Download the complete datasheet for Texas Instruments TMS320C5514AZCHA12 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.