High-performance 32-bit fixed-point digital signal processor operating at 1GHz, delivering 8000 MIPS. Features a 688-pin Flip Chip Ball Grid Array (FCBGA) package with a 0.8mm pin pitch, designed for surface mount applications. Includes 64KB of ROM program memory and supports Ethernet and I2C interfaces. Operates across a wide temperature range of -40°C to 100°C with programmable I/Os.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C6457CCMHA technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
688
PCB
688
Package Length (mm)
23.1(Max)
Package Width (mm)
23.1(Max)
Package Height (mm)
2.85(Max)
Seated Plane Height (mm)
3.3(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-012AA
Family Name
C6000
Data Bus Width
32bit
Instruction Set Architecture
VLIW
Numeric and Arithmetic Format
Fixed-Point
Program Memory Type
ROM
Program Memory Size
64KB
Maximum Speed
1000MHz
Number of Programmable I/Os
16
Device Million Instructions per Second
8000MIPS
Device Input Clock Speed
1000MHz
Typical Operating Supply Voltage
1.1|1.8|3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Interface Type
Ethernet/I2C
I2C
1
CAN
0
UART
0
Ethernet
1
USART
0
USB
0
SPI
0
I2S
0
Programmability
Yes
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320C6457CCMHA Datasheet
Download the complete datasheet for Texas Instruments TMS320C6457CCMHA to view detailed technical specifications.
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