32-bit fixed-point digital signal processor (DSP) operating at 1.2GHz, delivering 9600 MIPS. Features a 561-pin Flip Chip Ball Grid Array (FCBGA) package with a 0.8mm pin pitch, designed for surface mounting. Includes 64KB of ROM program memory and a VLIW instruction set architecture. Supports I2C interface and operates within a temperature range of 0°C to 95°C.
PackageFCBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Texas Instruments TMS320C6474FZUN2 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
561
PCB
561
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
2.65
Seated Plane Height (mm)
3.3(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
TMS320
Data Bus Width
32bit
Instruction Set Architecture
VLIW
Numeric and Arithmetic Format
Fixed-Point
Device Core
C64x
Program Memory Type
ROM
Program Memory Size
64KB
Maximum Speed
1200MHz
Number of Programmable I/Os
16
Device Million Instructions per Second
9600MIPS
Device Input Clock Speed
1200MHz
Typical Operating Supply Voltage
1.1|1.8V
Min Operating Temperature
0°C
Max Operating Temperature
95°C
Interface Type
I2C
I2C
1
CAN
0
UART
0
Ethernet
0
USART
0
USB
0
SPI
0
I2S
0
Programmability
Yes
Compliance
Cage Code
01295
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320C6474FZUN2 Datasheet
Download the complete datasheet for Texas Instruments TMS320C6474FZUN2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.