Texas Instruments
TMS320DM355ZCE135
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
Frequency135MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320DM355ZCE135 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Frequency
135MHz
Interface
I2C, SPI, USB, UART
Lead Free
Lead Free
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Max Supply Voltage
1.365V
Memory Size
8KB
Min Supply Voltage
1.235V
Mount
Surface Mount
Operating Supply Voltage
1.3V
Package Quantity
160
Packaging
Tray
Radiation Hardening
No
RAM Size
32KB
Reach SVHC Compliant
No
RoHS Compliant
Yes
Series
TMS320DM3x, DaVinci™
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
Texas Instruments TMS320DM355ZCE135 Datasheet
Download the complete datasheet for Texas Instruments TMS320DM355ZCE135 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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