32-bit RISC Digital Signal Processor (DSP) operating at 500 MHz, delivering 8000 MIPS. Features an ARM926EJ-S core with 8KB ROM and 32KB RAM. Surface-mount Flip Chip Ball Grid Array (FCBGA) package with 529 pins, measuring 19x19x2.65mm, and a 0.8mm pin pitch. Supports I2C, SPI, UART, and USB interfaces, with a typical operating voltage of 1.3V and an operating temperature range of -40°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320DM6467TZUTD1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
529
PCB
529
Package Length (mm)
19
Package Width (mm)
19
Package Height (mm)
2.65
Seated Plane Height (mm)
3.3(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
TMS320
Data Bus Width
32bit
Instruction Set Architecture
RISC
Device Core
ARM926EJ-S
Program Memory Type
ROM
Program Memory Size
8KB
RAM Size
32KB
Maximum Speed
500MHz
Number of Programmable I/Os
33
Device Million Instructions per Second
8000MIPS
Device Input Clock Speed
500MHz
Typical Operating Supply Voltage
1.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
I2C/SPI/UART/USB
I2C
1
CAN
0
UART
3
Ethernet
0
USART
0
USB
1
SPI
1
I2S
0
Programmability
Yes
Compliance
Cage Code
01295
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TMS320DM6467TZUTD1 Datasheet
Download the complete datasheet for Texas Instruments TMS320DM6467TZUTD1 to view detailed technical specifications.
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