The TMS320DM8127BCYE1 is a 684-pin Flip Chip Ball Grid Array (FCBGA) surface mount digital signal processor from Texas Instruments. It features a plastic package with a maximum height of 2.5mm and a seated plane height of 3.06mm. The device is designed for surface mount applications with a pin pitch of 0.8mm. Operating temperature range is not specified.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 684 |
| PCB | 684 |
| Package Length (mm) | 23.1(Max) |
| Package Width (mm) | 23.1(Max) |
| Package Height (mm) | 2.5 |
| Seated Plane Height (mm) | 3.06(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002.a.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments TMS320DM8127BCYE1 to view detailed technical specifications.
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